PACK EXPO International is one of the world’s largest packaging and processing trade shows, held biennially in Chicago, USA. A hub for innovation, the event attracts businesses and professionals from over 40 industries, including food, healthcare, and industrial products, offering a unique opportunity for leaders in the packaging and processing industries to converge.
Cybernetik is proud to be a part of the upcoming PACK EXPO International. We will be showcasing our innovative automation solutions for bag filling, case packing, palletizing, and conveying, along with our partners HSUSA.